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Comments
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galena71727yWhy? I dont see any probes for testing and one can probably use solder paste and a heat gun to get the job done!
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@codepoet bcaz it provides shock absorption when moving around in a war zone 💀
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I replaced a chip on my previous phone (first gen Droid), which was ball grid array soldered. 7 hours in hell with a heatgun, tweezers and a borrowed xray scanner. 2 hours on the phone with Motorola, who were super supportive in helping me flash the new bootloader afterwards.
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galena71727y@Condor Yep, but its the only other solution. You cant reflow again an there is no way in using a socket.
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RageBone5997y@JFK422 BGA ( ball grid array) is a bit less easy to do then you think.
Especially when the process needs to be reliable.
Just...
joke/meme