209
Comments
  • 17
    But why?
  • 12
    That's some pro skills
  • 6
    Why? I dont see any probes for testing and one can probably use solder paste and a heat gun to get the job done!
  • 13
    @codepoet bcaz it provides shock absorption when moving around in a war zone 💀
  • 4
    But how do you cool it?
  • 17
    I replaced a chip on my previous phone (first gen Droid), which was ball grid array soldered. 7 hours in hell with a heatgun, tweezers and a borrowed xray scanner. 2 hours on the phone with Motorola, who were super supportive in helping me flash the new bootloader afterwards.
  • 1
    @Condor Yep, but its the only other solution. You cant reflow again an there is no way in using a socket.
  • 1
    Quick fix for bent socket pin XD
  • 2
    Just... don't.
  • 1
    @Condor Product placement?
  • 2
    My brain hurts 🙈😲😫😭
    WHY would one do such thing!?
  • 1
    It would be over 9000 if it would actually work, no-one knows this
  • 2
    Soldering skills level 1151
  • 1
    @JFK422 BGA ( ball grid array) is a bit less easy to do then you think.
    Especially when the process needs to be reliable.
  • 1
    No way do all those connect 😵
Add Comment